End-of-life impact reduction through analysis and redistribution of disassembly depth: a case study in electronic device redesign

Hdl Handle:
http://hdl.handle.net/10149/249091
Title:
End-of-life impact reduction through analysis and redistribution of disassembly depth: a case study in electronic device redesign
Authors:
Giudice, F. (Fabio); Kassem, M. (Mohamad)
Citation:
Giudice, F. and Kassem, M. (2009) 'End-of-life impact reduction through analysis and redistribution of disassembly depth: a case study in electronic device redesign', Computers & Industrial Engineering, 57 (3), pp.677-690.
Publisher:
Elsevier
Journal:
Computers & Industrial Engineering
Issue Date:
Oct-2009
URI:
http://hdl.handle.net/10149/249091
DOI:
10.1016/j.cie.2009.01.007
Additional Links:
http://linkinghub.elsevier.com/retrieve/pii/S036083520900014X
Type:
Article
Language:
en
Keywords:
design for disassembly; disassembly depth; end-of-life; environmental impact; recovery
ISSN:
0360-8352
Rights:
Subject to restrictions author can archive post-print (ie final draft post-refereeing). For full details see http://www.sherpa.ac.uk/romeo/ [Accessed 17/10/2012].
Citation Count:
5 [Scopus, 17/10/2012]

Full metadata record

DC FieldValue Language
dc.contributor.authorGiudice, F. (Fabio)en_GB
dc.contributor.authorKassem, M. (Mohamad)en_GB
dc.date.accessioned2012-10-17T08:15:49Z-
dc.date.available2012-10-17T08:15:49Z-
dc.date.issued2009-10-
dc.identifier.citationComputers & Industrial Engineering; 57 (3):677-690en_GB
dc.identifier.issn0360-8352-
dc.identifier.doi10.1016/j.cie.2009.01.007-
dc.identifier.urihttp://hdl.handle.net/10149/249091-
dc.language.isoenen
dc.publisherElsevieren_GB
dc.relation.urlhttp://linkinghub.elsevier.com/retrieve/pii/S036083520900014Xen_GB
dc.rightsSubject to restrictions author can archive post-print (ie final draft post-refereeing). For full details see http://www.sherpa.ac.uk/romeo/ [Accessed 17/10/2012].en_GB
dc.subjectdesign for disassemblyen_GB
dc.subjectdisassembly depthen_GB
dc.subjectend-of-lifeen_GB
dc.subjectenvironmental impacten_GB
dc.subjectrecoveryen_GB
dc.titleEnd-of-life impact reduction through analysis and redistribution of disassembly depth: a case study in electronic device redesignen
dc.typeArticleen
dc.identifier.journalComputers & Industrial Engineeringen_GB
ref.citationcount5 [Scopus, 17/10/2012]en_GB
or.citation.harvardGiudice, F. and Kassem, M. (2009) 'End-of-life impact reduction through analysis and redistribution of disassembly depth: a case study in electronic device redesign', Computers & Industrial Engineering, 57 (3), pp.677-690.en_GB
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