Effects of Component Stand-off Height on Reliability of Solder Joints in Assembled Electronic Component

Hdl Handle:
http://hdl.handle.net/10149/620835
Title:
Effects of Component Stand-off Height on Reliability of Solder Joints in Assembled Electronic Component
Authors:
Njoku, J. E.; Mallik, S.; Bhatti, R. S.; Amalu, E. H. (Emeka); Ogunsem, B.
Affiliation:
School of Engineering, Faculty of Science and Engineering, University of Wolverhampton
Citation:
European Microelectronics Packaging Conference (EMPC 2015), Friedrichshafen Germany, Sep. 2015
Issue Date:
2015
URI:
http://hdl.handle.net/10149/620835
Type:
Meetings and Proceedings
Language:
en

Full metadata record

DC FieldValue Language
dc.contributor.authorNjoku, J. E.en
dc.contributor.authorMallik, S.en
dc.contributor.authorBhatti, R. S.en
dc.contributor.authorAmalu, E. H. (Emeka)en
dc.contributor.authorOgunsem, B.en
dc.date.accessioned2017-03-16T17:12:07Z-
dc.date.available2017-03-16T17:12:07Z-
dc.date.issued2015-
dc.identifier.urihttp://hdl.handle.net/10149/620835-
dc.language.isoenen
dc.titleEffects of Component Stand-off Height on Reliability of Solder Joints in Assembled Electronic Componenten
dc.typeMeetings and Proceedingsen
dc.contributor.departmentSchool of Engineering, Faculty of Science and Engineering, University of Wolverhamptonen
or.citation.harvardEuropean Microelectronics Packaging Conference (EMPC 2015), Friedrichshafen Germany, Sep. 2015en
All Items in TeesRep are protected by copyright, with all rights reserved, unless otherwise indicated.